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Version 1.2, Aug 2004 Datasheet DS-CoreControl-TDA21107 TDA21107 Published by Infineon Technologies AG http://www.infineon.com/DCDC Power Management & Drive N e v e r s t o p t h i n k i n g. CoreControl TM Page 1 of 12 DS-CoreControl-TDA21107 Contents: Features...........................................................................................................................3 Application........................................................................................................................3 Pinout Drawing and Description.............................................................................................3 General Description............................................................................................................4 Block Diagram...................................................................................................................4 Application Circuit...............................................................................................................5 Absolute Maximum Rating .................................................................................................................... 6 Thermal Characteristic.......................................................................................................................... 7 Operation Condition.............................................................................................................................. 7 Electrical Characteristic ........................................................................................................................ 8 Outline Diemension............................................................................................................9 Revision Histroy...............................................................................................................10 Sales Office Worldwide......................................................................................................11 CoreControl TM Page 2 of 12 DS-CoreControl-TDA21107 High speed Driver with bootstrapping for dual Power MOSFETs Features: * * * * * * * * * P-DSO-8 Fast rise and fall times for frequencies up to 1 MHz Adjustable High Side MOSFET gate drive voltage via external voltage supply to BOOT for optimizing ON losses and gate drive losses ( 5V to 12V is recommended ) Prevents from cross-conducting by adaptive gate drive control Supports shut-down mode for very low quiescent current through three-state input Compatible to standard PWM controller ICs (IFX, Intersil, Analog Devices, Richtek) Floating High Side MOSFET drive Power-on Overvoltage Protection Footprint compatible to ADP3418 Ideal for multi-phase Desktop CPU supplies on motherboards and VRMs Application: * * * Voltage Regulator Modules Low Output Voltage High Output Current DC-DC Converters Half-Bridge Class D Amplifier Type TDA21107 Package P-DSOP-8 Marking 21107 Ordering Code Q67042-S4251 Pinout Drawing and Description: CoreControl TM Page 3 of 12 DS-CoreControl-TDA21107 General Description The dual high speed driver is designed to drive a wide range of N-Channel low side and N-Channel high side MOSFETs with varying gate charges. It has a small propagation delay from PWM input pin to GATEHS and GATELS, short rise and fall times and the same pin configuration as the ADP3418. In addition it provides several protection features as well as a shut down mode for efficiency reasons. Target application The dual high speed driver is designed to work well in half-bridge type circuits where dual N-Channel MOSFETs are utilized. A circuit designer can fully take advantage of the drivers capabilities in highefficiency, high-density synchronous DC/DC converters that operate at high switching frequencies, e.g. in multi-phase converters for CPU supplies on motherboards and VRMs but also in motor drive and half bridge class-D amplifier type applications. Block Diagram VCC Internal 5V BOOT Control Logic HS Driver PowerOn OVP VCC Shoot Through Protection LS Driver GATEHS PHAS PWM GATELS GND CoreControl TM Page 4 of 12 DS-CoreControl-TDA21107 Application Circuit 1 2 3 4 A A B B 12VF1 IPD09N03LA IPD09N03LA C6 1uF/16V 1 C1 C2 R2 * 8 7 6 5 BOOST GATEHS PWM NC VCC PHASE PGND GATELS PWM signal f rom CoreControl controller C 2 3 4 22uF/16V Q1 Q2 330uF/16V L1 IPD05N03LA Q3 Q4 IPD06N03LA C5 1nF/16V R1 4R7 1uH 2200uF/6,3V 22uF/10V VCORE C R3* 1N4148 12V TDA21107 C7 1uF/16V C3 C4 *) R2 is the optional resistor for slowing down the high speed during turn-on *) R3 is the 500K ohm resistor for avoiding the fault start-up behavior of driver during turn-on D Layout Notice : 1. C1 and C2 should be placed at the drain of Q1 and Q2 and the source of Q3 and Q4. 2. C7 should be placed close to the VCC pin and GND pin of TDA21107. 3. 1N4148, C6 and R2 should be placed close to TDA21107. 4. The traces of GATEHS and PHASE should be routed in parallel and the trace width should not be less than 40 mil. 5. The trace width of GATELS should not be less than 40 mil and it should be clsoe to the gate pins of Q3 and Q4. 1 2 3 Title Size A4 Date: File: Number CoreControl Driver TDA21107 Revision D Application Circuit 09.08.2004 Sheet of C:\UserData\..\TDA21107_Application.SCHDOC Drawn By: 4 1,0 Edward Chang CoreControl TM Page 5 of 12 DS-CoreControl-TDA21107 Absolute Maximum Ratings At Tj = 25 C, unless otherwise specified Parameter Symbol Value Min MAX 15 7 15 Unit Voltage supplied to `VCC' pin; DC Voltage supplied to `PWM' pin Voltage supplied to `BOOT' pin referenced to `PHASE' VVCC VPWM VBOOT - VPHASE VBOOT VPHASE VGATEHS -0.3 -0.3 -0.3 V Voltage supplied to `BOOT' pin referenced to `GND' Voltage rating at `PHASE' pin, Voltage supplied to GATEHS pin referenced to `PHASE -0.3 -4 VPHASE - 0.3 Voltage supplied to GATELS pin referenced to `GND' VGATELS -0.3 30 15 VBOOT +0.3 VVCC +0.3 Junction temperature Storage temperature Lead temperature (Soldering, 10 seconds) ESD Rating; Human Body Model Machine Mode IEC climatic category; DIN EN 60068-1 55/150/56 TJ TS 0 -40 150 150 260 2 200 KV V C CoreControl TM Page 6 of 12 DS-CoreControl-TDA21107 Thermal Characteristic Parameter Symbol Min. Thermal resistance, junction-soldering point Thermal resistance, junction-ambient Values Typ. 90 125 Unit Max. K/W Operating Conditions At Tj = 25 C, unless otherwise specified Parameter Symbol Conditions Min. Values Typ. 12.0 Unit Max. 13.2 V Voltage supplied to `VCC' pins VVCC 10.8 Input signal transition frequency Power dissipation Junction temperature Ambient temperature f 50 500 KHz PTOT TJ TA TA = 25 C, TJ = 125 C 0 0 0.8 125 70 W C C CoreControl TM Page 7 of 12 DS-CoreControl-TDA21107 Electrical Characteristic At Tj = 25 C, unless otherwise specified Parameter Symbol Conditions Min. Values Typ. Max. Unit Supply Characteristic VCC supply current IVCC VVCC = 12 V VPWM = 0V Under-voltage lockout Under-voltage lockout VVCC falling threshold 7.25 8.05 8.85 VVCC rising threshold 8.6 9.4 10.2 V 5 7 mA Input Characteristic Current in `PWM' pin Current in `PWM' pin PWM pin open PWM Low level PWM High level IPWM_L IPWM_H VPWM_O VPWM_L VPWM_H V_PWM = 0 V V_PWM = 5 V -80 80 2.2 1.2 3.0 -110 110 2.5 1.4 3.5 -140 140 2.8 1.5 3.8 V A CoreControl TM Page 8 of 12 DS-CoreControl-TDA21107 At Tj = 25 C, unless otherwise specified Dynamic Characteristic Turn-on propagation Delay High Side Turn-off propagation delay High Side Rise time High Side Fall time High Side Turn-on propagation Delay Low Side Turn-off propagation delay Low Side Rise time Low Side Fall time Low Side td(ON)_HS 40 td(OFF)_HS 30 tr_HS tf_HS td(ON)_LS PPVCC = VVCC= 12 V CISS = 3000 pF 30 40 35 ns td(OFF)_LS 30 tr_LS tf_LS 30 30 Timing diagram Td(ON)_HS Tr_HS Td(OFF)_HS Tf_HS Td(ON)_LS Td(OFF)_LS Tf_LS Tr_LS At Tj = 25 C, unless otherwise specified Values Min. Typ. Max. Output Characteristic High Side (HS) and Low Side (LS), ensured by design Parameter Conditions HS; Source Output Reistance HS; Sink LS; Source LS; Sink VPVCC = VVCC= 12 V 2 1.5 1.6 1.2 Page 9 of 12 DS-CoreControl-TDA21107 Unit CoreControl TM Package Drawing P-DSO-8 Footprint Drawing P-DSO-8 e 1.27 mm A 5.69 mm L 1.31 mm B 0.65 mm CoreControl TM Page 10 of 12 DS-CoreControl-TDA21107 Revision History Datasheet DS-CoreControl-TDA21107 Actual Release: V1.1 Date: 22.03.2005 Page of actual Rel. 9 Page of prev. Rel. 9 Add td(OFF)_HS = 30 ns and td(OFF)_LS = 30 ns Previous Release: V1.0 Date: 10.08.2004 Subjects changed since last release For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see the address list on the last page or our webpage at http://www.infineon.com/DCDC CoreControlTM, OptiMOS and OptiMOS II are trademarks of Infineon Technologies AG. We listen to Your Comments Any information within this dokument that you feel is wrong, unclear or missing at all? Your feedback will help us to continously improve the quality of this dokument. Please send your proposal (including a reference to this dokument) to: mcdoku.comment@infineon.com Edition 2004-08-10 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 2004. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 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